The prosperous of ceramic board

With the continuous progress of electronic technology, the heat dissipation problem has gradually become the bottleneck limiting the development of high-power and lightweight electronic products. The continuous accumulation of heat in power electronic components makes the chip junction temperature gradually increase, and generates thermal stress, which leads to a series of reliability problems such as reduced life and color temperature changes. In the packaging application of power electronic components, the heat dissipation substrate not only bears the functions of electrical connection and mechanical support, but also is an important channel for heat transmission. For power-type electronic devices, the packaging substrate should have high thermal conductivity, insulation and heat resistance, as well as high thermal expansion coefficient matching with the chip strength. At present, metal core board (MCPCB) and ceramic board are the main heat dissipation substrates on the market. Due to the extremely low thermal conductivity of thermal insulation layer, MCPCB has become increasingly difficult to adapt to the development requirements of power electronic components. As a new heat dissipation material, ceramic substrate has incomparable comprehensive properties such as thermal conductivity and insulation, and the surface metallization of ceramic substrate is an important prerequisite for its practical application.